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| November 2006 rev 0.2 Low Frequency EMI Reduction IC Features * * * * * * * * * * * * * FCC approved method of EMI attenuation Provides up to 20dB of EMI suppression Generates a low EMI spread spectrum clock of the input frequency Optimized for 10MHz to 35MHz input frequency range Internal loop filter minimizes external components and board space 4 selectable spread ranges SSON control pin for spread spectrum enable and disable options Low Cycle-to-cycle jitter Wide operating range (3V to 5V) 16mA output drives TTL or CMOS compatible outputs Low power CMOS design Available in 8 pin SOIC and TSSOP Packages P2010A electromagnetic interference (EMI) at the clock source which provides system wide reduction of EMI of all clock dependent signals. The P2010A allows significant system cost savings by reducing the number of circuit board layers and shielding that are traditionally required to pass EMI regulations. The P2010A uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all-digital method. The P2010A modulates the output of a single PLL in order to "spread" the bandwidth of a synthesized clock and, more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal's bandwidth is called "spread spectrum clock generation". Product Description The P2010A is a selectable spread spectrum frequency modulator designed specifically for PC peripheral and embedded controller markets. The P2010A reduces Applications The P2010A is targeted towards the embedded controller market and PC peripheral markets including scanners, facsimile, MFP's, printers, PDA, IA, and GPS devices. Block Diagram FS0 SR1 SSON VDD Modulation XIN XOUT Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter VCO PLL Output Divider ModOUT VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 * Tel: 408-879-9077 * Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. November 2006 rev 0.2 Pin Configuration 1 XIN/CLK 1 2 XOUT 2 FS0 33 4 VSS 4 8 VDD 8 7 SR0 7 6 ModOUT 6 5 5 SSON P2010A P2040C P2010A Pin Description Pin# 1 2 3 4 5 6 7 8 Pin Name XIN/CLK XOUT FS0 VSS SSON ModOUT SR0 VDD Type I I I P I O I P Description Connect to crystal or externally generated clock signal. Connect to crystal. No connect if externally generated clock signal is used. Digital logic input used to select Input Frequency Range (see Table 1). This pin has an internal pull-up resistor. Ground Connection. Connect to system ground. Digital logic input used to enable Spread Spectrum function (Active Low). Spectrum function enable when low. This pin has an internal pull-low resistor. Spread Spectrum Clock Output. Digital logic input used to select Spreading Range (see Table 1). This pin has an internal pull-up resistor. Connect to +3.3V or +5.0V Spread Table 1 - Spread Range Selection FS0 1 1 0 0 SR0 0 1 0 1 Spreading Range +/- 1.50% +/- 2.50% +/- 1.25% +/- 2.00% Input Frequency 10MHz to 20MHz 10MHz to 20MHz 20MHz to 35MHz 20MHz to 35MHz Modulation rate (Fin/10)*20.83KHz (Fin/10)*20.83KHz (Fin/10)*20.83KHz (Fin/10)*20.83KHz Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 8 November 2006 rev 0.2 Spread Spectrum Selection P2010A Table 1 illustrates the possible spread spectrum options. The optimal setting should minimize system EMI to the fullest without affecting system performance. The spreading is described as a percentage deviation of the center frequency (Note: the center frequency is the frequency of the external reference input on XIN/CLK, Pin 1). Example of a typical printer or scanner application that operates on a clock frequency of 16MHz: A spreading selection of FS0=1 and SR0=1 provides a percentage deviation of +/-2.50%* (see Table 1) of Center Frequency. This results in the frequency on ModOUT being swept from 16.40MHz to 15.60MHz at a modulation rate of 33.33KHz (see Table 1). This particular example (see Figure below) given here is a common EMI reduction method for scanner, printer or embedded applications and has already been adopted by most of the leading manufacturers. Note: Spreading range selection varies from different system manufacturers and their designs. P2010A Application Schematic for Flat-Bed Scanner VDD 16MHz Crystal Input 1 XIN/CLK 2 XOUT 3 FS0 4 VSS VDD 8 SR0 7 ModOUT 6 SSON 5 P2010A 0.1F Connected to CLK input pin of the system Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 8 November 2006 rev 0.2 Absolute Maximum Ratings Symbol VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) P2010A Parameter Voltage on any pin with respect to Ground Rating -0.5 to +7 -65 to +125 -40 to+85 260 150 2 Unit V C C C C KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH IDD ICC VDD tON ZOUT Input Low Voltage Input High Voltage Input Low Current (pull-up resistor on inputs SR0, FS0) Input High Current (pull-down resistor on input SSON) XOUT output low current (at 0.4V, VDD = 3.3V) XOUT output high current (at 2.5V, VDD = 3.3V) Output Low Voltage (VDD=3.3V, IOL = 20mA) Output High Voltage (VDD=3.3V, IOH = 20mA) Static Supply Current Dynamic Supply Current (3.3V and 15pF loading) Operating Voltage Power Up Time (First locked clock cycle after power up) Clock Output Impedance Parameter Min GND 2.0 2.5 4 2.7 Typ 3 3 0.6 6 3.3 0.18 50 Max 0.8 VDD + 0.3 -35 35 0.4 8 5.5 Unit V V A A mA mA V V mA mA V mS AC Electrical Characteristics Symbol fIN tLH* tHL* tJC tD Input Frequency Output rise time (Measured at 0.8V to 2.0V) Output fall time (Measured at 2.0V to 0.8V) Jitter (Cycle to cycle) Output duty cycle Parameter Min 10 0.7 0.6 45 Typ 20 0.9 0.8 50 Max 35 1.1 1.0 360 55 Unit MHz nS nS pS % *tLH and tHL are measured into a capacitive load of 15pF Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 8 November 2006 rev 0.2 Package Information 8-lead (150-mil) SOIC Package P2010A E H D A2 A e B A 1 C L D Dimensions Symbol Min A1 A A2 B C D E e H L Inches Max 0.010 0.069 0.059 0.020 0.010 0.004 0.053 0.049 0.012 0.007 Millimeters Min Max 0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0 1.27 8 0.25 1.75 1.50 0.51 0.25 0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0 0.050 8 Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 8 November 2006 rev 0.2 8-lead TSSOP (4.40-MM Body) P2010A H E D A2 A e B A1 L C Dimensions Symbol Min A A1 A2 B c D E e H L 0.020 0 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8 0.50 0 Inches Max 0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30 Millimeters Min Max 1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8 Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 8 November 2006 rev 0.2 Ordering Information Part number P2010AF-08ST P2010AF-08SR P2010AG-08ST P2010AG-08SR I2010AF-08ST I2010AF-08SR I2010AG-08ST I2010AG-08SR P2010AF-08TT P2010AF-08TR P2010AG-08TT P2010AG-08TR I2010AF-08TT I2010AF-08TR I2010AG-08TT I2010AG-08TR P2010A Marking P2010AF P2010AF P2010AG P2010AG I2010AF I2010AF I2010AG I2010AG P2010AF P2010AF P2010AG P2010AG I2010AF I2010AF I2010AG I2010AG Package Type 8-Pin SOIC, Tube, Pb Free 8-Pin SOIC, Tape and Reel, Pb Free 8-Pin SOIC, Tube, Green 8-Pin SOIC, Tape and Reel, Green 8-Pin SOIC, Tube, Pb Free 8-Pin SOIC, Tape and Reel, Pb Free 8-Pin SOIC, Tube, Green 8-Pin SOIC, Tape and Reel, Green 8-Pin TSSOP, Tube, Pb Free 8-Pin TSSOP, Tape and Reel, Pb Free 8-Pin TSSOP, Tube, Green 8-Pin TSSOP, Tape and Reel, Green 8-Pin TSSOP, Tube, Pb Free 8-Pin TSSOP, Tape and Reel, Pb Free 8-Pin TSSOP, Tube, Green 8-Pin TSSOP, Tape and Reel, Green Temperature Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Device Ordering Information P2010A F-08-ST SR - SOIC, T/R TT - TSSOP, TUBE TR - TSSOP, T/R ST - SOIC, TUBE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS Deviation (%) and Spread option Identifier DEVICE NUMBER P = Commercial Temperature Range (0C to 70C) I = Industrial Temperature Range (-40C to 85C) Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 8 November 2006 rev 0.2 P2010A PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright (c) PulseCore Semiconductor All Rights Reserved Part Number: P2010A Document Version: 0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 (c) Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore's best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore's Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore's Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Frequency EMI Reduction IC Notice: The information in this document is subject to change without notice. 8 of 8 |
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